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Special Session 5
Metaverse and Digital Twins

Submission Link: http://www.easychair.org/conferences/?conf=icvr2022
(Select Track Special Session 5: Metaverse and Digital Twins)

Submission deadline: April 1, 2022
(Final Call!)

Both Metaverse and Digital Twins will use Virtual Reality (VR) technology. From a technical perspective, the Metaverse is still in its infancy and relies on the popularization of 5G or even 6G, while Digital Twins are already very mature. Through data connectivity and loop feedback, it can fully reproduce the real world. Under the highly developed form of the Metaverse, the digital simulation needs to support human beings to have an augmented reality experience that "mixes the fake with the real". "Perception" is transformed into an interactive interface, forming "perception is interaction". Digital Twins serve as the technical paradigm of reality simulation and the foundation of the mixed VR framework in the process of Metaverse construction.

The special conference of Metaverse and Digital Twins aims to bring together multidisciplinary research related to convergent applications of the Metaverse and Digital Twins. It includes realization mechanism, modeling method, application and popularization. Accepted papers will appear in the conference proceedings. The list of topics of interest includes, but is not limited to:

  Topics of interest include, but are not limited to:    

Modeling, Simulation Analysis and Process Control
Visual Perception Interaction and Operation
Digital Twins and Artificial Intelligence (AI)
The Spatiotemporal Environment of "Digital Twins"
3D Visualization, High-Precision Maps, Lidar Point Cloud
Metaverse Connects Perception and Shared Features
Metaverse Decentralization and Spatial Computing
From IoT Platforms to Metaverse Environments
Real-Time Data Collection Supported by Devices Such as Sensors

 

 Organizer  
Zhihan Lv
Email: lvzhihan@gmail.com

Zhihan Lv (SM’19) has contributed 300 papers including more than 70 papers on IEEE/ACM Transactions. He is Editor-in-Chief of Internet of Things and Cyber-Physical Systems(KeAi), an Associate Editor of 22 journals including ACM Transactions on Multimedia Computing, Communications, and Applications, IEEE Transactions on Intelligent Transportation System, IEEE Transactions on Network and Service Management, IEEE Technology Policy and Ethics Newsletter, and Leading Guest Editors for 40 special issues including 9 IEEE. He is Co-Chair or TPC of 50 conferences including ACM MM 2021, ACM IUI 2015-2022. He has reviewed 400 papers. He has received more than 20 awards from China, Europe, IEEE. He has received 1.5 million US dollars funding as PI. He has been involved in many European and Chinese projects supported with funding of 25 million US dollars. He has given more than 80 invited talks for universities and companies in Europe and China. He has given 20 keynote speech for International conferences.